CDU and Liquid Cooling

Air cooling generally copes to roughly 15 to 20kW per rack in a well designed hall. Between 20 and 40kW it gets difficult and expensive. Above 40kW, and certainly for dense GPU training racks at 60 to 130kW, liquid cooling is effectively the only practical option.

Direct-to-chip puts cold plates straight onto the CPUs and GPUs and removes heat at the source, supporting the highest densities. A rear door heat exchanger cools the air as it leaves the rack and is easier to retrofit without touching the servers. Rear doors suit medium density retrofits, direct-to-chip suits high density AI builds.

Through engineering rather than hope. We use quick disconnects rated for the application, pressure test every loop before fluid is introduced, use leak detection at rack and CDU level, and commission the system under load. Dripless disconnects mean servers can be added or removed without opening the loop.

Often yes. Rear door heat exchangers retrofit into most halls with a chilled water supply. Direct-to-chip retrofits depend on available facility water, floor loading and whether your servers accept cold plates. We assess this during the survey rather than guessing.

Yes. We specify the correct coolant chemistry, fill and bleed the system, and can take on scheduled maintenance covering fluid quality checks, filter changes and CDU servicing under a maintenance contract.